As per its own roadmap, the upcoming Zen 4 architecture will be manufactured on the TSMC 5nm process node. As for the Ryzen 7000 series processors, the new processors will feature a new CPU design, much like how Intel redesigned its 12th generation Alder Lake CPU. More to the point, the quick glimpse of the CPU also confirms an earlier report, when 3D renders of the processor’s unique lid first surfaced. The announcement also confirms AMD’s decision to switch from a PGA socket, that it has used for several generations, to an LGA socket design. More specifically, the Ryzen 7000 series of processors will be manufactured on a new LGA1718 socket, making it far larger than the current PGA1331 socket that is used with the AM4 socket. Of course, with Zen 4’s imminent arrival, that also means that we can expect AMD’s next-generation of products to support all of the latest features and hardware, including PCIe 5.0 and DDR5 memory.
